Inspection is performed following PCB lamination to determine the presence and degree of layer shifts. Along with AOI, X-ray inspection enables Advantech to control costs and improve quality by eliminating defective boards early in the production process.
Due to PCB increasing complexity and smaller sizes, X-ray inspection has become a necessity for ensuring the quality of PCB assemblies. X-ray inspection is an effective way to identify errors such as shorts, voids and opens as well as the solder integrity on new chip packages.
Experienced gained using X-ray inspection systems and analysis is important to accuracy.
Combining X-ray inspection and AOI allows Advantech to inspect hidden solder joints, and check boards for correct parts and placement. Advantech has years of experience setting up and configuring this test equipment.