Burn-in testing is performed for the purpose of screening or eliminating marginal devices, those with inherent defects or defects resulting from manufacturing issues that might contribute to failure over time. In the absence of burn-in, early device failure rates would be higher as well as overall lifetime failure rates. Stressing boards and components plus all the connections at or above maximum rated operating conditions while under load is a way to eliminate marginal products and increasing quality as well as dependability.
Type of Burn-In Tests
- Customization type: depends on the customer needs
- High/Low temperature operating type
- Constant temperature operating type